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pdiusbd12 usb interface device with parallel bus rev. 06 23 april 2001 product data c c 1. description the pdiusbd12 is a cost and feature optimized usb device. it is normally used in microcontroller based systems and communicates with the system microcontroller over the high-speed general purpose parallel interface. it also supports local dma transfer. this modular approach to implementing a usb interface allows the designer to choose the optimum system microcontroller from the available wide variety. this ?exibility cuts down the development time, risks, and costs by allowing the use of the existing architecture and minimize ?rmware investments. this results in the fastest way to develop the most cost effective usb peripheral solution. the pdiusbd12 fully conforms to the usb speci?cation rev. 1.1 . it is also designed to be compliant with most device class speci?cations: imaging class, mass storage devices, communication devices, printing devices, and human interface devices. as such, the pdiusbd12 is ideally suited for many peripherals like printer, scanner, external mass storage (zip drive), digital still camera, etc. it offers an immediate cost reduction for applications that currently use scsi implementations. the pdiusbd12 low suspend power consumption along with the lazyclock output allows for easy implementation of equipment that is compliant to the acpi?, onnow?, and usb power management requirements. the low operating power allows the implementation of bus powered peripherals. in addition, it also incorporates features like softconnect?, goodlink?, programmable clock output, low frequency crystal oscillator, and integration of termination resistors. all of these features contribute to signi?cant cost savings in the system implementation and at the same time ease the implementation of advanced usb functionality into the peripherals. 2. features n complies with the universal serial bus speci?cation rev. 1.1 n high performance usb interface device with integrated sie, fifo memory, transceiver and voltage regulator n compliant with most device class speci?cations n high-speed (2 mbytes/s) parallel interface to any external microcontroller or microprocessor n fully autonomous dma operation
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 2 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. n integrated 320 bytes of multi-con?guration fifo memory n double buffering scheme for main endpoint increases throughput and eases real-time data transfer n data transfer rates: 1 mbytes/s achievable in bulk mode, 1 mbits/s achievable in isochronous mode n bus-powered capability with very good emi performance n controllable lazyclock output during suspend n software controllable connection to the usb bus (softconnect?) n good usb connection indicator that blinks with traf?c (goodlink?) n programmable clock frequency output n complies with the acpi, onnow and usb power management requirements n internal power-on reset and low-voltage reset circuit n available in so28 and tssop28 pin packages n full industrial grade operation from - 40 to +85 c n higher than 8 kv in-circuit esd protection lowers cost of extra components n full-scan design with high fault coverage (>99%) ensures high quality n operation with dual voltages: 3.3 0.3 v or extended 5 v supply range of 3.6 to 5.5 v n multiple interrupt modes to facilitate both bulk and isochronous transfers. 3. pinning information 3.1 pinning fig 1. pin con?guration.
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 3 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. 3.2 pin description table 1: pin description symbol pin type [1] description data <0> 1 io2 bit 0 of bidirectional data. slew-rate controlled. data <1> 2 io2 bit 1 of bidirectional data. slew-rate controlled. data <2> 3 io2 bit 2 of bidirectional data. slew-rate controlled. data <3> 4 io2 bit 3 of bidirectional data. slew-rate controlled. gnd 5 p ground. data <4> 6 io2 bit 4 of bidirectional data. slew-rate controlled. data <5> 7 io2 bit 5 of bidirectional data. slew-rate controlled. data <6> 8 io2 bit 6 of bidirectional data. slew-rate controlled. data <7> 9 io2 bit 7 of bidirectional data. slew-rate controlled. ale 10 i address latch enable. the falling edge is used to close the latch of the address information in a multiplexed address/ data bus. permanently tied low for separate address/ data bus con?guration. cs_n 11 i chip select (active low). suspend 12 i,od4 device is in suspend state. clkout 13 o2 programmable output clock (slew-rate controlled). int_n 14 od4 interrupt (active low). rd_n 15 i read strobe (active low). wr_n 16 i write strobe (active low). dmreq 17 o4 dma request. dmack_n 18 i dma acknowledge (active low). eot_n 19 i end of dma transfer (active low). double up as v bus sensing. eot_n is only valid when asserted together with dmack_n and either rd_n or wr_n. reset_n 20 i reset (active low and asynchronous). built-in power-on reset circuit present on chip, so pin can be tied high to v cc . gl_n 21 od8 goodlink led indicator (active low) xtal1 22 i crystal connection 1 (6 mhz). xtal2 23 o crystal connection 2 (6 mhz). if external clock signal, instead of crystal, is connected to xtal1, then xtal2 should be ?oated. v cc 24 p voltage supply (4.0 - 5.5 v). to operate the ic at 3.3 v, supply 3.3 v to both v cc and v out3.3 pins. d - 25 a usb d - data line. d+ 26 a usb d+ data line.
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 4 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. [1] o2 : output with 2 ma drive od4: output open drain with 4 ma drive od8: output open drain with 8 ma drive io2: input and output with 2 ma drive o4 : output with 4 ma drive. 4. ordering information 5. block diagram v out3.3 27 p 3.3 v regulated output. to operate the ic at 3.3 v, supply a 3.3 v to both v cc and v out3.3 pins. a0 28 i address bit. a0 = 1 selects command instruction; a0 = 0 selects the data phase. this bit is a dont care in a multiplexed address and data bus con?guration and should be tied high. table 1: pin description continued symbol pin type [1] description table 2: ordering information packages temperature range outside north america north america pkg. dwg. # 28-pin plastic so - 40 c to +85 c pdiusbd12 d pdiusbd12 d sot136-1 28-pin plastic tssop - 40 c to +85 c pdiusbd12 pw pdiusbd12pw dh sot361-1 this is a conceptual block diagram and does not include each individual signal. fig 2. block diagram.
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 5 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. 6. functional description 6.1 analog transceiver the integrated transceiver interfaces directly to the usb cables through termination resistors. 6.2 voltage regulator a 3.3 v regulator is integrated on-chip to supply the analog transceiver. this voltage is also provided as an output to connect to the external 1.5 k w pull-up resistor. alternatively, the pdiusbd12 provides softconnect technology with an integrated 1.5 k w pull-up resistor. 6.3 pll a 6 mhz to 48 mhz clock multiplier pll (phase-locked loop) is integrated on-chip. this allows for the use of a low-cost 6 mhz crystal. emi is also minimized due to the lower frequency crystal. no external components are needed for the operation of the pll. 6.4 bit clock recovery the bit clock recovery circuit recovers the clock from the incoming usb data stream using 4 oversampling principle. it is able to track jitter and frequency drift speci?ed by the usb speci?cation. 6.5 philips serial interface engine (psie) the philips sie implements the full usb protocol layer. it is completely hardwired for speed and needs no ?rmware intervention. the functions of this block include: synchronization pattern recognition, parallel/serial conversion, bit stuf?ng/de-stuf?ng, crc checking/generation, pid veri?cation/generation, address recognition, and handshake evaluation/generation. 6.6 softconnect the connection to the usb is accomplished by bringing d+ (for high-speed usb device) high through a 1.5 k w pull-up resistor. in the pdiusbd12, the 1.5 k w pull-up resistor is integrated on-chip and is not connected to v cc by default. the connection is established through a command sent by the external/system microcontroller. this allows the system microcontroller to complete its initialization sequence before deciding to establish connection to the usb. re-initialization of the usb bus connection can also be performed without requiring to pull out the cable. the pdiusbd12 will check for usb v bus availability before the connection can be established. v bus sensing is provided through pin eot_n. see section 3.2 pin description for details. sharing of v bus sensing and eot_n can be easily accomplished by using v bus voltage as the pull-up voltage for the normally open-drain output of the dma controller pin.
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 6 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. it should be noted that the tolerance of the internal resistors is higher (25%) than that speci?ed by the usb speci?cation (5%). however, the overall v se voltage speci?cation for the connection can still be met with good margin. 6.7 goodlink good usb connection indication is provided through goodlink technology. during enumeration, the led indicator will blink on momentarily corresponding to the enumeration traf?c. when the pdiusbd12 is successfully enumerated and con?gured, the led indicator will be permanently on. subsequent successful (with acknowledgement) transfer to and from the pdiusbd12 will blink off the led. during suspend, the led will be off. this feature provides a user-friendly indicator on the status of the usb device, the connected hub and the usb traf?c. it is a useful ?eld diagnostics tool to isolate faulty equipment. this feature helps lower ?eld support and hotline costs. 6.8 memory management unit (mmu) and integrated ram the mmu and the integrated ram buffer the difference in speed between usb, running in bursts of 12 mbits/s and the parallel interface to the microcontroller. this allows the microcontroller to read and write usb packets at its own speed. 6.9 parallel and dma interface a generic parallel interface is de?ned for ease-of-use, speed, and allows direct interfacing to major microcontrollers. to a microcontroller, the pdiusbd12 appears as a memory device with 8-bit data bus and 1 address bit (occupying 2 locations). the pdiusbd12 supports both multiplexed and non-multiplexed address and data bus. the pdiusbd12 also supports dma (direct memory access) transfer which allows the main endpoint (endpoint 2) to directly transfer to and from the local shared memory. both single-cycle and burst mode dma transfers are supported. 6.10 example of parallel interface to an 80c51 microcontroller in the example shown in figure 3 , the ale pin is permanently tied low to signify a separate address and data bus con?guration. the a0 pin of the pdiusbd12 connects to any of the 80c51 i/o ports. this port controls the command or data phase to the pdiusbd12. the multiplexed address and data bus of the 80c51 can now be connected directly to the data bus of the pdiusbd12. the address phase will be ignored by the pdiusbd12. the clock input signal of the 80c51 (pin xtal1) can be provided by output clkout of the pdiusbd12.
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 7 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. 7. dma transfer direct memory address (dma) allows an ef?cient transfer of a block of data between the host and local shared memory. using a dma controller, data transfer between the pdiusbd12s main endpoint (endpoint 2) and local shared memory can happen autonomously without local cpu intervention. preceding any dma transfer, the local cpu receives from the host the necessary setup information and programs the dma controller accordingly. typically, the dma controller is set up for demand transfer mode and the byte count register and the address counter are programmed with the right values. in this mode, transfers occur only when the pdiusbd12 requests them and are terminated when the byte count register reaches zero. after the dma controller has been programmed, the dma enable bit of the pdiusbd12 is set by the local cpu to initiate the transfer. the pdiusbd12 can be programmed for single-cycle dma or burst mode dma. in single-cycle dma, the dmreq pin is deactivated for every single acknowledgement by the dmack_n before being re-asserted. in burst mode dma, the dmreq pin is kept active for the number of bursts programmed in the device before going inactive. this process continues until the pdiusbd12 receives a dma termination notice through pin eot_n. this will generate an interrupt to notify the local cpu that dma operation is completed. for dma read operation, the dmreq pin will only be activated whenever the buffer is full, signalling that the host has successfully transferred a packet to the pdiusbd12. with the double buffering scheme, the host can start ?lling up the second buffer while the ?rst buffer is being read out. this parallel processing increases the effective throughput. when the host does not ?ll up the buffer completely (less than 64 bytes or fig 3. example of a parallel interface to an 80c51 microcontroller. pdiusbd12 80c51 int_n a0 data [7:0] wr_n rd_n clkout cs_n ale xtal1 rd/p3.7 wr/p3.6 p [0.7:0.0]/ad [7:0] any i/o port (e.g. p3.3) into/p3.2 sv00870
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 8 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. 128 bytes for single direction iso con?guration), the dmreq pin will be deactivated at the last byte of the buffer regardless of the current dma burst count. it will be re-asserted on the next packet with a refreshed dma burst count. similarly, for dma write operations, the dmreq pin remains active whenever the buffer is not full. when the buffer is ?lled up, the packet is sent over to the host on the next in token and dmreq will be reactivated if the transfer was successful. also, the double buffering scheme here will improve throughput. for non-isochronous transfer (bulk and interrupt), the buffer needs to be completely ?lled up by the dma write operation before the data is sent to the host. the only exception is at the end of dma transfer, when the activation of pin eot_n will stop dma write operation and the buffer content will be sent to the host on the next in token. for isochronous transfers, the local cpu and dma controller have to guarantee that they are able to sink or source the maximum packet size in one usb frame (1 ms). the assertion of pin dmack_n automatically selects the main endpoint (endpoint 2), regardless of the current selected endpoint. the dma operation of the pdiusbd12 can be interleaved with normal i/o access to other endpoints. dma operation can be terminated by resetting the dma enable register bit or the assertion of eot_n together with dmack_n and either rd_n or wr_n. the pdiusbd12 supports dma transfer in single address mode and it can also work in dual address mode of the dma controller. in the single address mode, dma transfer is done via the dreq, dmack_n, eot_n, wr_n and rd_n control lines. in the dual address mode, pins dmreq, dmack_n and eot_n are not used; instead cs_n, wr_n and rd_n control signals are used. the i/o mode transfer protocol of pdiusbd12 needs to be followed. the source of the dmac is accessed during the read cycle and the destination during the write cycle. transfer needs to be done in two separate bus cycles, storing the data temporarily in the dmac. 8. endpoint description the pdiusbd12 endpoints are suf?ciently generic to be used by various device classes ranging from imaging, printer, mass storage and communication device classes. the pdiusbd12 endpoints can be con?gured for 4 operating modes depending on the set mode command. the 4 modes are: mode 0 non-isochronous transfer (non-iso mode) mode 1 isochronous output only transfer (iso-out mode) mode 2 isochronous input only transfer (iso-in mode) mode 3 isochronous input and output transfer (iso-i/o mode).
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 9 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. [1] in: input for the usb host; out: output from the usb host. [2] generic endpoints can be used either as bulk or interrupt endpoint. [3] the main endpoint (endpoint number 2) is double-buffered to ease synchronization with the real-time applications and to increase throughput. this endpoint supports dma access. [4] denotes double buffering. the size shown is for a single buffer. table 3: endpoint con?guration endpoint number endpoint index transfer type direction [1] max. packet size (bytes) mode 0 (non-iso mode) 0 0 control out 16 1in16 1 2 generic [2] out 16 3in16 2 4 generic [2] [3] out 64 [4] 5in64 [4] mode 1 (iso-out mode) 0 0 control out 16 1in16 1 2 generic [2] out 16 3in16 2 4 isochronous [3] out 128 [4] mode 2 (iso-in mode) 0 0 control out 16 1in16 1 2 generic [2] out 16 3in16 2 5 isochronous [3] in 128 [4] mode 3 (iso-i/o mode) 0 0 control out 16 1in16 1 2 generic [2] out 16 3in16 2 4 isochronous [3] out 64 [4] 5in64 [4]
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 10 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. 9. main endpoint the main endpoint (endpoint number 2) is the primary endpoint for sinking or sourcing relatively large amounts of data. it implements the following features to ease this task: ? double buffering. this allows parallel operation between usb access and local cpu access thus increasing throughput. buffer switching is handled automatically. this results in transparent buffer operation. ? dma (direct memory access) operation. this can be interleaved with normal i/o operation to other endpoints. ? automatic pointer handling during dma operation. no local cpu intervention is necessary when crossing the buffer boundary. ? con?gurable endpoint for either isochronous transfer or non-isochronous (bulk and interrupt) transfer. 10. command summary table 4: command summary name destination code (hex) transaction initialization commands set address/enable device d0 write 1 byte set endpoint enable device d8 write 1 byte set mode device f3 write 2 bytes set dma device fb write/read 1 byte data ?ow commands read interrupt register device f4 read 2 bytes select endpoint control out 00 read 1 byte (optional) control in 01 read 1 byte (optional) endpoint 1 out 02 read 1 byte (optional) endpoint 1 in 03 read 1 byte (optional) endpoint 2 out 04 read 1 byte (optional) endpoint 2 in 05 read 1 byte (optional) read last transaction status control out 40 read 1 byte control in 41 read 1 byte endpoint 1 out 42 read 1 byte endpoint 1 in 43 read 1 byte endpoint 2 out 44 read 1 byte endpoint 2 in 45 read 1 byte read buffer selected endpoint f0 read n bytes write buffer selected endpoint f0 write n bytes
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 11 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. 11. command description 11.1 command procedure there are three basic types of commands: initialization, data flow and general commands. respectively, these are used to initialize the function; for data ?ow between the function and the host; and some general commands. 11.2 initialization commands initialization commands are used during the enumeration process of the usb network. these commands are used to enable the function endpoints. they are also used to set the usb assigned address. 11.2.1 set address/enable code (hex) d0 transaction write 1 byte this command is used to set the usb assigned address and enable the function. set endpoint status control out 40 write 1 byte control in 41 write 1 byte endpoint 1 out 42 write 1 byte endpoint 1 in 43 write 1 byte endpoint 2 out 44 write 1 byte endpoint 2 in 45 write 1 byte acknowledge setup selected endpoint f1 none clear buffer selected endpoint f2 none validate buffer selected endpoint fa none general commands send resume f6 none read current frame number f5 read 1 or 2 bytes table 4: command summary continued name destination code (hex) transaction address : the value written becomes the address. enable : a 1 enables this function. fig 4. set address/enable command: bit allocation. 76 54 32 0 1 0 0 power on value address enable sv00825 00 00 00
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 12 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. 11.2.2 set endpoint enable code (hex) d8 transaction write 1 byte the generic/isochronous endpoints can only be enabled when the function is enabled via the set address/enable command. 11.2.3 set mode code (hex) f3 transaction write 2 bytes the set mode command is followed by two data writes. the ?rst byte contains the con?guration bits. the second byte is the clock division factor byte. generic/isochronous endpoint : a value of 1 indicates the generic/isochronous endpoints are enabled. fig 5. set endpoint enable command: bit allocation. see ta b l e 5 for bit allocation. fig 6. set mode command, con?guration byte.
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 13 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. table 5: set mode command, con?guration byte: bit allocation bit symbol description 7 endpoint configuration these two bits set the endpoint con?gurations as follows: mode 0 (non-iso mode) mode 1 (iso-out mode) mode 2 (iso-in mode) mode 3 (iso-i/o mode) see section 8 endpoint description for more details. 4 softconnect a 1 indicates that the upstream pull-up resistor will be connected if v bus is available. a 0 means that the upstream resistor will not be connected. the programmed value will not be changed by a bus reset. 3 interrupt mode a 1 indicates that all errors and naking are reported and will generate an interrupt. a 0 indicates that only ok is reported. the programmed value will not be changed by a bus reset. 2 clock running a 1 indicates that the internal clocks and pll are always running even during suspend state. a 0 indicates that the internal clock, crystal oscillator and pll are stopped whenever not needed. to meet the strict suspend current requirement, this bit needs to be set to 0. the programmed value will not be changed by a bus reset. 1 no lazyclock a 1 indicates that clkout will not switch to lazyclock. a 0 indicates that the clkout switches to lazyclock 1ms after the suspend pin goes high. lazyclock frequency is 30 khz 40%. the programmed value will not be changed by a bus reset. see ta b l e 6 for bit allocation. fig 7. set mode command, clock division factor byte. 76 5 4 3 2 1 1 1 0 power on value 10 xx 00 clock division factor reserved sv00862 set_to_one sof-only interrupt mode
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 14 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. 11.2.4 set dma code (hex) fb transaction read/write 1 byte the set dma command is followed by one data write/read to/from the dma con?guration register. dma con?guration register: during dma operation, the two-byte buffer header (status and byte length information) is not transferred to/from the local cpu. this allows dma data to be continuous and not interleaved by chunks of these headers. for dma read operations, the header will be skipped by the pdiusbd12. see section 11.3.4 read buffer command. for dma write operations, the header will be automatically added by the pdiusbd12. this provides for a clean and simple dma data transfer. table 6: clock division factor byte: bit allocation bit symbol description 7 sof-only interrupt mode setting this bit to 1 will cause the interrupt line to be activated due to the start of frame clock (sof) only, regardless of the setting of pin-interrupt mode, bit 5 of set dma. 6 set_to_one this bit needs to be set to 1 prior to any dma read or dma write operation. this bit should always be set to 1 after power. it is zero after power-on reset. 3 to 0 clock division factor the value indicates the clock division factor for clkout. the output frequency is 48 mhz/(n+1) where n is the clock division factor. the reset value is 11. this will produce the output frequency of 4 mhz which can then be programmed up or down by the user. the minimum value of n is 0, giving a maximum frequency of 48 mhz. the maximum value of n is 11 giving a minimum frequency of 4 mhz. the pdiusbd12 design ensures no glitching during frequency change. the programmed value will not be changed by a bus reset. see ta b l e 7 for bit allocation. fig 8. set dma command.
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 15 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. 11.3 data ?ow commands data ?ow commands are used to manage the data transmission between the usb endpoints and the external microcontroller. much of the data ?ow is initiated via an interrupt to the microcontroller. the microcontroller utilizes these commands to access and determine whether the endpoint fifos have valid data. table 7: set dma command: bit allocation bit symbol description 7 endpoint index 5 interrupt enable a 1 allows for an interrupt to be generated whenever the endpoint buffer is validated (see section 11.3.7 validate buffer command). normally turned off for dma operation to reduce unnecessary cpu servicing. 6 endpoint index 4 interrupt enable a 1 allows for an interrupt to be generated whenever the endpoint buffer contains a valid packet. normally turned off for dma operation to reduce unnecessary cpu servicing. 5 interrupt pin mode a 0 signi?es a normal interrupt pin mode where an interrupt is generated as a logical or of all the bits in the interrupt registers. a 1 signi?es that the interrupt will occur when start of frame clock (sof) is seen on the upstream usb bus. the other normal interrupts are still active. 4 auto reload when this bit is set to 1, the dma operation will automatically restart. 3 dma direction this bit determines the direction of data ?ow during a dma transfer. a 1 means external shared memory to pdiusbd12 (dma write); a 0 means pdiusbd12 to the external shared memory (dma read). 2 dma enable writing a 1 to this bit will start dma operation through the assertion of pin dmreq. the main endpoint buffer needs to be full (for dma read) or empty (for dma write) before dmreq will be asserted. in a single cycle dma mode, the dmreq is deactivated upon receiving dmack_n. in burst mode dma, the dmreq is deactivated after the number of burst is exhausted. it is then asserted again for the next burst. this process continues until eot_n is asserted together with dmack_n and either rd_n or wr_n, which will reset this bit to 0 and terminate the dma operation. the dma operation can also be terminated by writing a 0 to this bit. 1 to 0 dma burst selects the burst length for dma operation: 00 single-cycle dma 01 burst (4-cycle) dma 10 burst (8-cycle) dma 11 burst (16-cycle) dma
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 16 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. 11.3.1 read interrupt register code (hex) f4 transaction read 2 bytes this command indicates the origin of an interrupt. the endpoint interrupt bits (bits 0 to 5) are cleared by reading the endpoint last transaction status register through read last transaction status command. the other bits are cleared after reading the interrupt registers. see ta b l e 1 2 for bit allocation. fig 9. interrupt register, byte 1. table 8: read interrupt register, byte 1: bit allocation bit symbol description 7 suspend change when the pdiusbd12 did not receive 3 sofs, it will go into suspend state and the suspend change bit will be high. any change to the suspend or awake state will set this bit high and generate an interrupt. 6 bus reset after a bus reset an interrupt will be generated this bit will be 1. a bus reset is identical to a hardware reset through the reset_n pin with the exception that a bus reset generates an interrupt noti?cation and the device is enabled at default address 0. dma eot: this bit signi?es that dma operation is completed. fig 10. interrupt register, byte 2: bit allocation.
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 17 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. 11.3.2 select endpoint code (hex) 00 to 05 transaction read 1 byte (optional) the select endpoint command initializes an internal pointer to the start of the selected buffer. optionally, this command can be followed by a data read, which returns this byte. 11.3.3 read last transaction status register code (hex) 40 to 45 transaction read 1 byte the read last transaction status command is followed by one data read that returns the status of the last transaction of the endpoint. this command also resets the corresponding interrupt ?ag in the interrupt register, and clears the status, indicating that it was read. this command is useful for debugging purposes. since it keeps track of every transaction, the status information is overwritten for each new transaction. full/empty: a 1 indicates the buffer is full, 0 indicates an empty buffer. stall: a 1 indicates the selected endpoint is in the stall state. fig 11. select endpoint command: bit allocation. see ta b l e 9 for bit allocation. fig 12. read last transaction status register.
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 18 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. 11.3.4 read buffer code (hex) f0 transaction read multiple bytes (max. 130) the buffer pointer is not reset to the top of the buffer by the read buffer command. this means that reading or writing a buffer can be interrupted by any other command (except for select endpoint). the data in the buffer are organized as follows: ? byte 0: reserved; can have any value ? byte 1: number/length of data bytes ? byte 2: data byte 1 table 9: read last transaction status register: bit allocation bit symbol description 7 previous status not read a 1 indicates a second event occurred before the previous status was read 6 data 0/1 packet a 1 indicates the last successful received or sent packet had a data1 pid 5 setup packet a 1 indicates the last successful received packet had a setup token (this will always read 0 for in buffers) 4 to 1 error code see table 10 error codes 0 data receive/transmit sussess a 1 indicates data has been received or transmitted successfully table 10: error codes error code (binary) description 0000 no error 0001 pid encoding error; bits 7 to 4 are not the inversion of bits 3 to 0 0010 pid unknown; encoding is valid, but pid does not exist 0011 unexpected packet; packet is not of the type expected (= token, data or acknowledge), or setup token to a non-control endpoint 0100 token crc error 0101 data crc error 0110 time out error 0111 never happens 1000 unexpected end-of-packet 1001 sent or received nak 1010 sent stall, a token was received, but the endpoint was stalled 1011 over?ow error, the received packet was longer than the available buffer space 1101 bitstuff error 1111 wrong data pid; the received data pid was not the expected one
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 19 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. ? byte 3: data byte 2 ? etc. the ?rst two bytes will be skipped in the dma read operation. thus, the ?rst read will get data byte 1, the second read will get data byte 2, etc. the pdiusbd12 can determine the last byte of this packet through the eop termination of the usb packet. 11.3.5 write buffer code (hex) f0 transaction write multiple bytes (max. 130) the write buffer command is followed by a number of data writes, which load the endpoints buffer. the data must be organized in the same way as described in the read buffer command. the ?rst byte (reserved) should always be 0. during dma write operation, the ?rst two bytes will be bypassed. thus, the ?rst write will write into data byte 1, the second write will write into data byte 2, etc. for non-isochronous transfer (bulk or interrupt), the buffer should be completely ?lled before the data is sent to the host and a switch to the next buffer occurs. the exception is at the end of dma transfer indicated by activation of eot_n, when the current buffer content (completely full or not) will be sent to the host. remark: there is no protection against writing or reading over a buffers boundary or against writing into an out buffer or reading from an in buffer. any of these actions could cause an incorrect operation. data in an out buffer are only meaningful after a successful transaction. the exception is during dma operation on the main endpoint (endpoint 2), in which case the pointer is automatically pointed to the second buffer after reaching the boundary (double buffering scheme). 11.3.6 clear buffer code (hex) f2 transaction none when a packet is received completely, an internal endpoint buffer full ?ag is set. all subsequent packets will be refused by returning a nak. when the microcontroller has read the data, it should free the buffer by the clear buffer command. when the buffer is cleared, new packets will be accepted. 11.3.7 validate buffer code (hex) fa transaction none when the microprocessor has written data into an in buffer, it should set the buffer full ?ag by the validate buffer command. this indicates that the data in the buffer are valid and can be sent to the host when the next in token is received.
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 20 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. 11.3.8 set endpoint status code (hex) 40 to 45 transaction write 1 byte a stalled control endpoint is automatically unstalled when it receives a setup token, regardless of the content of the packet. if the endpoint should stay in its stalled state, the microcontroller can re-stall it. when a stalled endpoint is unstalled (either by the set endpoint status command or by receiving a setup token), it is also re-initialized. this ?ushes the buffer and if it is an out buffer it waits for a data 0 pid, if it is an in buffer it writes a data 0 pid. even when unstalled, writing set endpoint status to 0 initializes the endpoint. 11.3.9 acknowledge setup code (hex) f1 transaction none the arrival of a setup packet ?ushes the in buffer and disables the validate buffer and clear buffer commands for both in and out endpoints. the microcontroller needs to re-enable these commands by the acknowledge setup command. this ensures that the last setup packet stays in the buffer and no packet can be sent back to the host until the microcontroller has acknowledged explicitly that it has seen the setup packet. the microcontroller must send the acknowledge setup command to both the in and out endpoints. stalled: a 1 indicates the endpoint is stalled. fig 13. set endpoint status: bit allocation.
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 21 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. 11.4 general commands 11.4.1 send resume code (hex) f6 transaction none sends an upstream resume signal for 10 ms. this command is normally issued when the device is in suspend. the resume command is not followed by a data read or write. 11.4.2 read current frame number code (hex) f5 transaction read 1 or 2 bytes this command is followed by one or two data reads and returns the frame number of the last successfully received sof. the frame number is returned least signi?cant byte ?rst. 12. interrupt modes [1] bit 7 of clock division factor byte of set mode command (see ta bl e 6 ). [2] bit 5 of set dma command (see ta b l e 7 ). [3] normal interrupts from interrupt register. fig 14. read current frame number. table 11: interrupt modes sof-only interrupt mode [1] interrupt pin mode [2] interrupt types 0 0 normal [3] 0 1 normal + sof [3] 1 x sof only
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 22 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. 13. limiting values [1] equivalent to discharging a 100 pf capacitor via a 1.5 k w resistor. [2] values are given for device only; in-circuit v esd(max) = 8000 v. [3] for open-drain pins v esd(max) = 2000 v. table 12: limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v cc supply voltage - 0.5 +6.0 v v i input voltage - 0.5 v cc + 0.5 v i latchup latchup current v i < 0 or v i >v cc - 200 ma v esd electrostatic discharge voltage i li <15 m a [1] [2] - 4000 [3] v t stg storage temperature - 60 +150 c p tot total power dissipation - 95 mw table 13: recommended operating conditions symbol parameter conditions min max unit v cc1 dc supply voltage (main mode) apply to pin v cc only 3.6 5.5 v v cc2 dc supply voltage (alternate mode) apply to pins v cc and v out3.3 3.0 3.6 v v i dc input voltage 0 5.5 v v i/o dc input voltage for i/o 0 5.5 v v ai/o dc input voltage for analog i/o 0 3.6 v v o dc output voltage 0 v cc v t amb operating ambient temperature in free air - 40 +85 c
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 23 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. 14. static characteristics [1] includes external resistors of 18 w 1% on d+ and d - . table 14: dc characteristics (supply pins) symbol parameter conditions min typ max unit i cc(susp) suspend supply current oscillator stopped and inputs connected to gnd or v cc -- 15 m a i cc operating supply current - 15 - ma table 15: dc characteristics (digital pins) symbol parameter conditions min typ max unit input levels v il low level input voltage -- 0.8 v v ih high level input voltage 2.0 -- v v hys hysteresis voltage st (schmitt trigger) pins 0.4 - 0.7 v output levels v ol low level output voltage i ol = rated drive i ol =20 m a -- 0.4 0.1 v v v oh high level output voltage i oh = rated drive i oh =20 m a 2.4 v cc - 0.1 -- v v leakage current i oz off-state output current od (open drain) pins -- 5 m a i li input leakage current -- 5 m a table 16: dc characteristics (ai/o pins) symbol parameter conditions min max unit leakage current i lz off-state leakage current 0 v < v in < 3.3 v - 10 m a input levels v di differential input sensitivity |(d+) - (d - )| 0.2 - v v cm differential common mode range includes v di range 0.8 2.5 v v se single-ended receiver threshold 0.8 2.0 v output levels v ol static output low r l of 1.5 k w to 3.6 v - 0.3 v v oh static output high r l of 15 k w to gnd 2.8 3.6 v capacitance c in transceiver capacitance pin to gnd - 20 pf output resistance z drv [1] driver output resistance steady state drive 29 44 w pull-up resistance z pu pull-up resistance softconnect = on 1.1 1.9 k w
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 24 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. 15. dynamic characteristics [1] test circuit, see figure 21 . [2] characterized but not implemented as production test. guaranteed by design. table 17: ac characteristics (ai/o pins; full speed) [1] c l = 50 pf; r pu = 1.5 k w on d+ to v cc ; unless otherwise speci?ed. symbol parameter conditions min max unit driver characteristics t r rise time 10% to 90% of | v oh - v ol | 420ns t f fall time 10% to 90% of | v oh - v ol | 420ns rfm differential rise/fall time matching (t r /t f ) 90 110 % v crs output signal crossover voltage 1.3 2.0 v driver timings t eopt source eop width see figure 15 160 175 ns t deop differential data to eop transition skew see figure 15 - 2+5ns receiver timings: t jr1 receiver data jitter tolerance to next transition - 18.5 +18.5 ns t jr2 receiver data jitter tolerance for paired transitions - 9+9ns t eopr1 eop width at receiver must reject as eop; see figure 15 [2] - 40 ns t eopr2 eop width at receiver must accept as eop; see figure 15 [2] 82 - ns fig 15. differential data-to-eop transition skew and eop width. sv00837 t period differential data lines crossover point crossover point extended differential data to seo/eop skew n * t period + t deop source eop width: t eopt receiver eop width: t eopr1 , t eopr2
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 25 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. [1] can be negative. table 18: ac characteristics (parallel interface) symbol parameter conditions min max unit ale timings t lh ale high pulse width 20 - ns t avll address valid to ale low time 10 - ns t llax ale low to address transition time - 10 ns write timings t clwl cs_n (dmack_n) low to wr_n low time 0 [1] - ns t whch wr_n high to cs_n (dmack_n) high time 5 - ns t avwl a0 valid to wr_n low time 0 [1] - ns t whax wr_n high to a0 transition time 5 - ns t wl wr_n low pulse width 20 - ns t wdsu write data setup time 30 - ns t wdh write data hold time 10 - ns t wc write cycle time 500 - ns read timings t clrl cs_n (dmack_n) low to rd_n low time 0 [1] - ns t rhch rd_n high to cs_n (dmack_n) high time 5 - ns t avrl a0 valid to rd_n low time 0 [1] - ns t rl rd_n low pulse width 20 - ns t rldd rd_n low to data driven time - 20 ns t rhdz rd_n high to data high-z time - 20 ns t rc read cycle time 500 - ns fig 16. ale timing.
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 26 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. fig 17. parallel interface timing (i/o and dma). table 19: ac characteristics (dma) symbol parameter conditions min max unit single-cycle dma timings t wa dmack_n low pulse width 90 - ns t alrl dmack_n low to dmreq low time - 90 ns t shah rd_n/wr_n high to dmack_n high time 10 - ns t ahrh dmack_n high to dmreq high time - 550 ns t el eot_n low pulse width pins dmack_n, rd_n/wr_n and eot_n low all low - 10 ns burst dma timings t wsh rd_n/wr_n high time 380 - ns t shrl rd_n/wr_n high to dmreq low time - 220 ns eot timings t elrl eot_n low to dmreq low time - 40 ns
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 27 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. eot_n is considered valid when dmack_n, rd_n/wr_n and eot_n are all low. fig 18. single-cycle dma timing. fig 19. burst dma timing. fig 20. dma terminated by eot. t el sv00874 dmreq dmack_n rd_n/wr_n eot_n (1) t shah t ahrh t alrl t wa
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 28 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. 16. test information the dynamic characteristics of the analog i/o ports (d + and d - ) as listed in ta b l e 1 7 , were determined using the circuit shown in figure 21 . fig 21. load for d + /d - . d. u. t. test point c l = 50pf 1.5k w is internal 15k w 22 w sv00849
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 29 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. 17. package outline fig 22. so28 package outline. unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p q z y w v q references outline version european projection issue date iec jedec eiaj mm inches 2.65 0.30 0.10 2.45 2.25 0.49 0.36 0.32 0.23 18.1 17.7 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 sot136-1 x 14 28 w m q a a 1 a 2 b p d h e l p q detail x e z c l v m a e 15 1 (a ) 3 a y 0.25 075e06 ms-013 pin 1 index 0.10 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.71 0.69 0.30 0.29 0.050 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 0 5 10 mm scale so28: plastic small outline package; 28 leads; body width 7.5 mm sot136-1 97-05-22 99-12-27
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 30 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. fig 23. tssop28 package outline. unit a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec eiaj mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 9.8 9.6 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.8 0.5 8 0 o o 0.13 0.1 0.2 1.0 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 sot361-1 mo-153 95-02-04 99-12-27 0.25 w m b p z e 114 28 15 pin 1 index q a a 1 a 2 l p q detail x l (a ) 3 h e e c v m a x a d y 0 2.5 5 mm scale tssop28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm sot361-1 a max. 1.10
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 31 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. 18. soldering 18.1 introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all surface mount ic packages. wave soldering can still be used for certain surface mount ics, but it is not suitable for ?ne pitch smds. in these situations re?ow soldering is recommended. 18.2 re?ow soldering re?ow soldering requires solder paste (a suspension of ?ne solder particles, ?ux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for re?owing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical re?ow peak temperatures range from 215 to 250 c. the top-surface temperature of the packages should preferable be kept below 220 c for thick/large packages, and below 235 c small/thin packages. 18.3 wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was speci?cally developed. if wave soldering is used the following conditions must be observed for optimal results: ? use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. ? for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. ? for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners.
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 32 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. during placement and before soldering, the package must be ?xed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activated ?ux will eliminate the need for removal of corrosive residues in most applications. 18.4 manual soldering fix the component by ?rst soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the ?at part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c. 18.5 package related soldering information [1] all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . [2] these packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). [3] if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. [4] wave soldering is only suitable for lqfp, qfp and tqfp packages with a pitch (e) equal to or larger than 0.8 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [5] wave soldering is only suitable for ssop and tssop packages with a pitch (e) equal to or larger than 0.65 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. table 20: suitability of surface mount ic packages for wave and re?ow soldering methods package soldering method wave re?ow [1] bga, hbga, lfbga, sqfp, tfbga not suitable suitable hbcc, hlqfp, hsqfp, hsop, htqfp, htssop, hvqfn, sms not suitable [2] suitable plcc [3] , so, soj suitable suitable lqfp, qfp, tqfp not recommended [3] [4] suitable ssop, tssop, vso not recommended [5] suitable
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 33 of 36 9397 750 08117 ? philips electronics n.v. 2001. all rights reserved. 19. revision history table 21: revision history rev date cpcn description 06 20010423 product speci?cation; version 6. supersedes pduiusbd12_5 of 19990108 (9397 750 04979). data sheet modi?cations: ? converted to dbii template. ? section 12 interrupt modes added. ? section 16 test information created.
philips semiconductors pdiusbd12 usb interface device with parallel bus product data rev. 06 23 april 2001 34 of 36 9397 750 08117 ? philips electronics n.v. 2001 all rights reserved. 20. data sheet status [1] please consult the most recently issued data sheet before initiating or completing a design. [2] the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the latest information is ava ilable on the internet at url http://www.semiconductors.philips.com. 21. de?nitions short-form speci?cation the data in a short-form speci?cation is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values de?nition limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. 22. disclaimers life support these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes philips semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise speci?ed. 23. trademarks acpi is an open industry speci?cation for pc power management, co-developed by intel corp., microsoft corp. and toshiba goodlink is a trademark of royal philips electronics onnow is a trademark of microsoft corp. softconnect is a trademark of royal philips electronics. data sheet status [1] product status [2] de?nition objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be publish ed at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. changes will be communicated according to the customer product/process change noti?cation (cpcn) procedure snw-sq-650a.
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? philips electronics n.v. 2001. printed in the netherlands all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. date of release: 23 april 2001 document order number: 9397 750 08117 contents philips semiconductors pdiusbd12 usb interface device with parallel bus 1 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 ordering information . . . . . . . . . . . . . . . . . . . . . 4 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 functional description . . . . . . . . . . . . . . . . . . . 5 6.1 analog transceiver . . . . . . . . . . . . . . . . . . . . . . 5 6.2 voltage regulator . . . . . . . . . . . . . . . . . . . . . . . 5 6.3 pll . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6.4 bit clock recovery . . . . . . . . . . . . . . . . . . . . . . . 5 6.5 philips serial interface engine (psie) . . . . . . . 5 6.6 softconnect . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6.7 goodlink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6.8 memory management unit (mmu) and integrated ram. . . . . . . . . . . . . . . . . . . . . 6 6.9 parallel and dma interface. . . . . . . . . . . . . . . . 6 6.10 example of parallel interface to an 80c51 microcontroller . . . . . . . . . . . . . . . . . . . 6 7 dma transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 8 endpoint description . . . . . . . . . . . . . . . . . . . . . 8 9 main endpoint . . . . . . . . . . . . . . . . . . . . . . . . . . 10 10 command summary . . . . . . . . . . . . . . . . . . . . 10 11 command description . . . . . . . . . . . . . . . . . . . 11 11.1 command procedure . . . . . . . . . . . . . . . . . . . 11 11.2 initialization commands . . . . . . . . . . . . . . . . . 11 11.2.1 set address/enable . . . . . . . . . . . . . . . . . . . . 11 11.2.2 set endpoint enable . . . . . . . . . . . . . . . . . . . . 12 11.2.3 set mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 11.2.4 set dma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 11.3 data flow commands . . . . . . . . . . . . . . . . . . . 15 11.3.1 read interrupt register . . . . . . . . . . . . . . . . . . 16 11.3.2 select endpoint. . . . . . . . . . . . . . . . . . . . . . . . 17 11.3.3 read last transaction status register . . . . . . . 17 11.3.4 read buffer . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 11.3.5 write buffer . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 11.3.6 clear buffer . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 11.3.7 validate buffer. . . . . . . . . . . . . . . . . . . . . . . . . 19 11.3.8 set endpoint status . . . . . . . . . . . . . . . . . . . . . 20 11.3.9 acknowledge setup. . . . . . . . . . . . . . . . . . . . . 20 11.4 general commands . . . . . . . . . . . . . . . . . . . . 21 11.4.1 send resume . . . . . . . . . . . . . . . . . . . . . . . . . 21 11.4.2 read current frame number . . . . . . . . . . . . . . 21 12 . . . . . . . . . . . . . . . . . . . . . . . . interrupt modes 21 13 limiting values . . . . . . . . . . . . . . . . . . . . . . . . . 22 14 static characteristics . . . . . . . . . . . . . . . . . . . . 23 15 dynamic characteristics . . . . . . . . . . . . . . . . . 24 16 test information . . . . . . . . . . . . . . . . . . . . . . . . 28 17 package outline . . . . . . . . . . . . . . . . . . . . . . . . 29 18 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 18.1 introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 18.2 reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 31 18.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 31 18.4 manual soldering. . . . . . . . . . . . . . . . . . . . . . . 32 18.5 package related soldering information . . . . . . 32 19 revision history . . . . . . . . . . . . . . . . . . . . . . . . 33 20 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 34 21 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 22 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 23 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

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